TAG’s engineering division has core competencies in mechanical, electrical, systems, and embedded systems engineering with a focus on custom enclosures and custom PCBs for projects where heat dissipation, environmental conditions, and power are concerns. Our capabilities include leading projects from initiation through production and perpetual supply, as well as consulting services, rapid prototyping, and local part production. We also offer training courses covering a wide range of engineering and technical skill sets.

Core Competencies

• Ruggedize and Marinize Existing Components and Systems
  • Integrated Heat Dissipation for Electronics Cooling
  • Waterproofing
  • Shock and Vibration Handling
  • Integrated Power Conversion and Cleaning of Dirty Power for EW/SI
  • Fully Custom Enclosures or COTS Modification
• Rapid Prototyping
  • Build a functional prototype for bench testing or field use in days to weeks.
  • Get a single unit or low quantity to test feasibility, function, or fit.
• Rapid Product Development
  • Idea to Mass Production in 6 Months
  • Starting from an idea or functional need we can define product requirements and work through our development process to design a mass production ready product with a comprehensive technical data package.
• 3D Printing
  • From prototypes and models up to field-ready production parts, in as little as 1 day.
  • We can print your designs or create and modify as needed.
• Consulting
  • Design for Manufacturing (DFM)
  • Marinization (Waterproofing, Shock and Vibration, Heat Dissipation)
  • SWaP-C
  • Heat Mitigation and Electronics Cooling
  • High Volume Production, Production Management, and Quality Control
  • Engineering Support for: mechanical design, electrical design, PCB layout, embedded systems firmware, 3D printing, COTS integration, and more
• Reverse Engineering
  • Detailed analysis of electrical, mechanical, and manufacturing characteristics to enable modification, repair, and replication.